www.disco.co.jp

• charset: utf-8
• equiv: Content-Type content: text/html; charset=utf-8
• equiv: Pragma content: no-cache
• equiv: Cache-Control content: no-cache
• equiv: Expires content: 0
• equiv: X-UA-Compatible content: IE=edge
• name: viewport content: width=device-width, initial-scale=1.0, minimum-scale=0.5, maximum-scale=3, user-scalable=yes
• name: description content: Welcome to the official website of DISCO CORPORATION, manufacturer of precision processing equipment and tooling. This website offers a wide range of product and technology information related to our semiconductor processing equipment and information regarding our buyback and resale of used semiconductor equipment.Investor relations, careers, and DISCO corporate information is also available.

• http://www.disco.co.jp/eg/index.html
• News
• About DISCO
• Corporate Outline
• Corporate Philosophy
• DISCO Corporate History
• Business Calendar
• Exhibition Schedule
• SDGs / ESG / CSR
• Your Nearest DISCO Office
• Investors
• Recruit
• Contact
• http://www.disco.co.jp/#
• 日本語
• 繁體中文
• 简体中文
• 한글
• Go to top of Product/
• http://www.disco.co.jp/
• https://www.disco.co.jp/kabra/index_eg.html
• https://www.disco.co.jp/eg/solution/library/laser/sapphire.html
• https://www.disco.co.jp/eg/products/accessory/dwr1722.html
• https://www.disco.co.jp/eg/solution/library/dicing/dicing_thin.html
• https://www.disco.co.jp/eg/csr/activity/earthquake_resistance/index.html
• https://www.disco.co.jp/eg/solution/library/other/usw.html
• News
• Disaster Information
• IR News
• http://www.disco.co.jp/news/disaster/disaster.html
• http://www.disco.co.jp/news/disaster/earthquake.html
• Laser Saw Shipments Exceed 4,000 Units
• DISCO Ranked No. 1 in the 2026 “100 Best Workplaces in Japan” Ranking
• DISCO Awarded “Winner Company” for Corporate Governance of the Year® 2025
• Development of Three Laser Saws: DFL7162, DFL7363, DFL7563
• Development of DFD6080: A Dicing Saw for Package Dicing (Max. 400 x 400 mm)
• Development of DFG8561: A Fully Automatic Grinder Supporting Φ300 mm Wafers
• Development of DP26: Dry Polishing Wheels for Small-Die Devices
• Acquisition of Accreditation for Dimensional Calibration in Accordance with International Standard ISO/IEC17025:2017
• http://www.disco.co.jp/products/
• http://www.disco.co.jp/solution/
• http://www.disco.co.jp/support/
• http://www.disco.co.jp/training/
• http://www.disco.co.jp/solution/testcut/
• http://www.disco.co.jp/solution/charged/
• http://www.disco.co.jp/solution/technical_review/
• Product Information
• Solutions
• Support
• Training Services
• Precision Machines
• Dicing Saws
• Laser Saws
• Grinders
• Polishers
• Wafer Mounter
• Inspection systems
• Die Separator
• Surface Planer
• WaterJet Saw
• Precision Processing Tools
• Dicing Blades
• Grinding Wheels
• Dry Polishing Wheels
• For Your Safety
• Accessory Equipment
• Related Products
• Cut-Off Wheels
• Catalog Downloads
• Manual Downloads
• Tips & Tricks for Kerf Check
• Blade Dicing
• Laser Dicing
• Grinding
• Polishing
• DBG/SDBG
• Others
• DISCO Technical Review
• Technology Introduction by DISCO Engineers
• Applications Support
• Dicing and Grinding Service
• Customer Support System
• Equipment Recycling Service
• Troubleshooting and FAQs for Precision Processing Equipment
• Troubleshooting and FAQs for Precision Processing Tools (Blades/Wheels)
• DISCO's Trouble Support
• Precision Processing Tools (Blades/Wheels)
• Useful Improvement Information (Technical Newsletters)
• SDS
• Inspection Sheet Search
• Certificates / Parameter Sheets
• Discontinued Equipment List
• Products That Use CFCs
• Course Composition and Training Manual
• How to apply for training
• Course List
• Training fee / Training hours
• Training Services and Facilities
• FAQs and Inquiries
• Training Center in Korea
• Training Center in Taiwan
• Training Center in China
• Recruit
• Reporting Line
• Personal Information Protection Policy
• User Agreement
• Use of the DISCO Corporate Name
• Guarantee policy for customer using DISCO Products
• Policy for Process Support
• Policy regarding the use of cloud services
• Using DISCO's Copyrighted Materials
• Policy on Customer Harassment
• Reworking by a Third Party
• Laser Oscillator Refurbishment by Third Parties
• What kind of company is DISCO?
• http://www.disco.co.jp/eg/

• DISCO Awarded 9th in “Best Workplaces in Asia 2025” Ranking
• Customer Equipment Improvement Information (CSMDC)
• https://www.youtube.com/channel/UC-zU4ietDMx2-k3Ar0fbsMA
• https://twitter.com/disco_pr

            [ JPRS database provides information on network administration. Its use is    ]
[ restricted to network administration purposes. For further information,     ]
[ use 'whois -h whois.jprs.jp help'. To suppress Japanese output, add'/e'     ]
[ at the end of command, e.g. 'whois -h whois.jprs.jp xxx/e'.                 ]
Domain Information:
a. [Domain Name]                DISCO.CO.JP
g. [Organization]               DISCO CORPORATION
l. [Organization Type]          Corporation
m. [Administrative Contact]     YN3687JP
n. [Technical Contact]          MS116JP
p. [Name Server]                ns1.disco.co.jp
p. [Name Server]                ns2.disco.co.jp
p. [Name Server]                ns3.disco.co.jp
s. [Signing Key]                
[State]                         Connected (2027/03/31)
[Registered Date]               1995/03/20
[Connected Date]                1995/05/02
[Last Update]                   2026/04/01 01:02:22 (JST)
        

			User-agent: *

Sitemap: https://www.disco.co.jp/jp/sitemap.xml
Sitemap: https://www.disco.co.jp/eg/sitemap.xml
Sitemap: https://www.disco.co.jp/cn_t/sitemap.xml
Sitemap: https://www.disco.co.jp/cn_s/sitemap.xml
Sitemap: https://www.disco.co.jp/kr/sitemap.xml
        

Teknisk SEO

On-Page SEO

Indhold og UX