pitek.us

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• http://pitek.us/
• Basis Of Technology
• Electrical Connectors
• Heat Exchanger & Heat Pipe
• Thermal Connectors
• Heat Conducting, Electrically Insulated
• Thermal Insulators
• PCB Test Fixtures
• Removable Interconnect
• Brochure
• Press Releases
• Executive Summary
• TDR, S parameter, Eye diagrams
• Test results
• interconnect technologies
• Papers on PI
• MicroModules Systems Papers
• Patents
• Contact Us
• Engineering
• Licencees
• Successful Projects
• Job Openings
• Site map
• Visual site map
• SEM, FIB, AFM pictures of metal
• SEM pictures of Particle Interconnect
• Optical Microscope pictures of PI
• New squeegee blade technology
• Standard wiping contact spalling
• Momentum plating
• Mechanical welding
• test
• burn-in
• characterization
• Smart Card/Smart Label
• emulation
• production
• KGD
• System In a Package (SIP) Sockets
• field replacable
• BGA
• http://pitek.us/LandGridArrays.html
• PLCC
• QFP
• TSOP
• CSP (Chip Scale Package)
• SIP
• Lead Frames
• Tab Frames
• Stacked Die / Wafers
• J-Lead
• Gull Wing Lead
• Flip Chip
• RFID Tags
• Reducing Cray form factor using PI
• MCM
• test fixtures.
• probe cards,
• PCB/Cable Connector
• PCB Drill Hole/Blind Via
• LCD/Cable Connector
• Hard Disk drive head assembly
• Push Button Contact
• Micro-Fuses (Resetable & Blown Once)
• Micro-Reed Relays
• Built-In Resistors
• High power
• Battery Terminal
• EMI Shielding
• Aircraft Rivet Replacement
• Mechanical fasteners
• Counter-IED
• Accelerometer
• Fiber Optic Databus
• Cooling Suit
• Enhanced Body Armor
• PI Licensee Legal Papers
• PI Legal Papers
• Johnson Mathey
• Hughes Legal Papers
• "Particle Interconnect" (PI) overview
• Controlled impedance to lead of package / die pad
• Features comparison
• Applications
• Sample products
• FEM analysis
• Additional work by MMS, TI, and HP.

• Mil-Std-883C
• U.S. Environmental Protection Agency - Design for the Environment (DfE) - Solders in Electronics: A Life-Cycle Assessment
• Database for solder properties with emphasis on new lead-free solders

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